Faculty updated on “Nano Scale Heat Transfer for Application of Electronic Cooling”
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Faculty updated on “Nano Scale Heat Transfer for Application of Electronic Cooling”

March 14, 2017

In recent times, electronic industry has exceptionally impressed upon the human fraternity with its faster growing technologies and products having multi-tasking capabilities. Also miniaturisation of electronics has exponentially increased over the years and advanced fabrication techniques has helped to bring it  into reality.

Due to its miniaturisation  there is a reduction in heat transfer area which results in huge accumulation of heat which may lead to the failure of the component.  The heat flux of the microprocessors and memory devices are reaching the  order of KW/cm2 in the near future which requires new novel cooling technologies which increases its life span.

In the past two decades the cooling of electronics has gained lot of interest among researchers and industry personnel. Keeping this in mind, the Department of Mechanical Engineering, NIE, conducted a Faculty Development Programme (FDP) that focussed on understanding micro and nano scale heat transfer and its application in developing new cooling technologies for electronic components.

The ten sessions focussed on numerical and experimental approach to understand the fluid flow and heat transfer behaviour in micro channels and its application towards electronic cooling. Various speakers from reputed Institutes like IITs, NITs and leading Industries in the  micro processor shared their  experiences in their field.

Around 30 faculties from various colleges participated in the event where M.Tech students and research scholars were also present.

Prof. T. Sundararajan from IIT Madras delivered the keynote address on Nanofluid Heat Transfer in Micro-channels. Dr. A. Satyabhama from NITK, Surathkal, gave a technical talk on Augmentation of Boiling Heat Transfer for Electronic Cooling while Harish Jagdish from Intel handled a session on System Perspective on Thermal Management of Electronic Components in the Compute Industry.

Dr. Karthik Balasubramanian from NIT Warangal delivered a lecture on Stabilised Flow Boiling through Micro channels – An Experimental Approach; K.Chandrashekar, Assistant Professor, NIE ,  gave a talk on micro fluidics and its application in bio-medical industries. The last session on Fabrication of Micro Channels & Numerical and Experimental Investigation of Heat Transfer and  Fluid Flow in Micro channels   was handled by N.S. Srikanth, Assistant Professor,  NIE.

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The FDP gave the participants a brief overview about thermal management of  electronics  and designing of novel cooling technologies.

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