To promote international collaboration in the field of Education and Academic Research
Mysuru: Vidya Vikas Institute of Engineering & Technology (VVIET), Mysuru and Indian Printed Circuit Board Association (IPCA), signed a Memorandum of Understanding (MoU) on Feb.19 to promote international collaboration in the field of Education and Academic Research on the occasion of one-day National Seminar on “Emerging Trends in PCB Design, Manufacturing and Assembly Technology” conducted by VVIET in association with ESSCI and IPCA.
VVIET and IPCA have consented to play an effective role in uplifting the technology sector through skill enhancement of the Technical and Engineering students and Faculty members through class room and industry specific practical training.
M. Thyagarajan, IPCA – Treasurer & CEO, Nuline Technologies, who was the chief guest, emphasised the increasing demand for electronic products and said it is estimated that by 2020 the demand for electronic products will be more than 300 billion dollars. Stressing on the importance of collaboration of industries with the colleges he explained the role of Electronic Sector Skills Council of India [ESSCI] and IPCA in skill development and emerging trends in PCB manufacturing.
Kaveesh V. Gowda, Secretary, VVET, presided. Amulya Mohapatra, Member-Technical-IPCA, Dr. Devaraj Singh, General Manager-Technical ESSCI, Delhi, O.J. Sathish, CEO, Sienna ECAD, Dr. M. Ravishankar, Principal, VVIET, Dr. Bindhu A. Thomas, Head, Department of ECE, were present.
This post was published on February 21, 2018 6:21 pm