Mysore/Mysuru: JSS Science and Technology University (JSS STU), Mysuru, signed a Memorandum of Understanding (MoU) with Government Tool Room and Training Centre (GTTC), Mysuru, recently.
The collaboration is an initiative towards enhancing skill development, R&D and related services. The MoU was signed by Dr. S. A. Dhanaraj, Registrar of JSS STU, Radhakrishna, Deputy General Manager-cum-Principal Grade 2, GTTC and Dr. K. Krishna Murthy, Assistant Professor, GTTC.
The scope of this MoU is for improvement of industry-institute-interaction by giving exposure to students of BE and M.Tech in technological upgradation, innovation and competitiveness of an industry through internship and training. This can be a platform for students to get placement and will also benefit research scholars and faculty members in research activities.
Speaking on the occasion, Radhakrishna briefed about the industry and highlighted about Siemens Centre of Excellence, Robotics Lab, Additive Manufacturing Unit. He stressed that there are quite a lot of training avenues available with them, which helps the students to get good jobs. He also mentioned a few Government initiatives which will be extended free of cost.
Dr. S.A. Dhanaraj opined that this MoU will be beneficial to students and research scholars of JSS STU and contributions from GTTC will help the students in upgrading their skills.
Dr. Santosh Kumar, Incharge Vice-Chancellor said that this collaboration will extend mutual help and narrow the industry-institutions gap.
Dr. S.B. Kivade, Principal and Dean (Engineering and Technology), SJCE, JSS STU, Dr. V. Ramesh, Head, Department of Industrial and Production Engineering, Dr. B.S. Harish, Deputy Registrar, Dr. M. Savitha, Associate Professor, Department of I & P Engineering – Co-ordinator & Mentor representing SJCE, JSS STU, Dr. Vanishri Arun, Coordinator, Academic/International Engagements, JSS STU, Dr. Dayakar G. Devaru, Dr. B.Manjunatha, Dr. M.G. Skanda, and Prof. C. Santosh of Industrial & Production Engineering Department were present during the MoU signing event.
This post was published on September 19, 2022 6:31 pm